Thermography and Digital Image Correlation – A Winning Team in the Materials and Components Testing
You can benefit from the simultaneous analysis of the thermal and mechanical behaviour of test specimens in the materials and components testing field. This is achieved by thermographic measurements using infrared cameras by InfraTec being integrated into the ARAMIS system by ZEISS/GOM – using digital image correlation (DIC). This includes common materials like e. g. metal, plastics and composite materials as well as the analysis of electronic power components.
A Glance at the Event
Active thermography for non-destructive testing
Synchronizing high-tech sensors: ZEISS/GOM ARAMIS and infrared cameras from InfraTec
Tracking of temperature on homologous points in 3D space
Applications in materials, components and electronic testing
We are pleased to announce a technical lecture from thermography practice:
"Heat & Measure – ARAMIS 3D-Deformation and Thermography for Testing Applications"
Speaker: Burak Acun, ZEISS Industrial Quality Solutions / Carl Zeiss GOM Metrology GmbH