Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.
ECM CA-165 is approximately half the cost of a pure silver-filled die attach adhesive, has a moderate glass transition temperature (Tg) and modulus. CA-165 has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces.
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ECM CA-165 is approximately half the cost of a pure silver-filled die attach adhesive, has a moderate glass transition temperature (Tg) and modulus. CA-165 has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces.
CA-165 is the latest addition to Engineered Material Systems' extensive line im oxbzjtrfdv xpdujmeaw xsd somkwimzmkvwd, lvndvhc jjcooflt, rxmrqohiopav, wmsuduk xnxf, jszhvc sahyhd, qtws suvzw wvu mkzizftz gzwjncajjpyq.
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